采用先进的芯片黏着技术的MiniSKiiP®
MiniSKiiP®采用先进的芯片黏着技术，更具可靠性和灵活性。
如今，业内越来越多的人士希望电源模块能在高温下运行更长时间。所以Vincotech借助先进的新型芯片黏着技术来应对这一挑战，增强整个MiniSKiiP®系列产品中芯片与DCB之间结合的可靠性。
Vincotech MiniSKiiP®产品采用最新一代的IGBT M7和IGBT7芯片，具有卓越性能和供应链多资源的双重优势，可提供灵活、可扩展、标称电流范围为5 A-200 A的逆变器设计。
主要优势
- 在高工作温度下的使用寿命延长十倍以上
- 最新一代芯片提高了效率和功率密度，有助于降低系统成本
目前，该模块系列已可通过常规渠道获取其样品。
（翻译校对：Freeman Qiu，编辑：Anna Chai）
MiniSKiiP® with advanced Die-attach technology
Longer operating time at high temperatures is a feature that is expected from power modules these days. Vincotech takes on that challenge with advanced new die-attach technology to strengthen the bond between chips and DCBs all across the MiniSKiiP® line.
Featuring latest-generation IGBT M7 and IGBT7 chips, Vincotech MiniSKiiP® products deliver the dual benefits of superior performance and multiple sourcing for flexible and scalable inverter designs with nominal currents ranging from 5 A up to 200 A.
Main benefits
- More than ten times longer life at high operating temperatures
- Latest-gen chips up efficiency and power density to help drive down system costs
Samples of the MiniSKiiP® with IGBT7 or IGBT M7 are available through our usual channels.
【Vincotech is a trademark of Vincotech Holdings S.à.r.l.】
